Polishing pad for electrochemical mechanical polishing

Details Polishing pad for electrochemical mechanical polishing Polishing pad for electrochemical mechanical polishing

2005-02-01

2005-02-01

Nguyen, George (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S036000, C451S288000, C451S287000, C205S087000, C204S212000

Reexamination Certificate

active

06848977

ABSTRACT:
The present invention provides a polishing pad for electrochemical mechanical polishing of conductive substrate. The pad comprises a plurality of grooves formed in a polishing surface of the polishing pad, the grooves being adapted to facilitate the flow of polishing fluid over the polishing pad. The conductive layers are respectively formed in the grooves and are in electrical communication with each other.

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