Method of forming integrated circuitry, method of forming...

Details Method of forming integrated circuitry, method of forming... Method of forming integrated circuitry, method of forming...

2005-10-04

2005-10-04

Dang, Phuc T. (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S637000, C438S667000

Reexamination Certificate

active

06951805

ABSTRACT:
A method of forming memory circuitry sequentially includes forming a plurality of metal interconnect lines over a semiconductive substrate. A plurality of memory cell storage devices comprising voltage or current controlled resistance setable semiconductive material are then formed. In one implementation, a method of forming integrated circuitry includes forming a metal interconnect line over a semiconductive substrate. A device comprising two metal comprising electrodes separated by a voltage or current controlled resistance setable semiconductive material is formed. The resistance setable a semiconductive material is formed after forming the metal interconnect line.

REFERENCES:
patent: 3271591 (1966-09-01), Ovshinsky
patent: 3622319 (1971-11-01), Sharp
patent: 3743847 (1973-07-01), Boland
patent: 3961314 (1976-06-01), Klose et al.
patent: 3966317 (1976-06-01), Wacks et al.
patent: 3983542 (1976-09-01), Ovshinsky
patent: 3988720 (1976-10-01), Ovshinsky
patent: 4177474 (1979-12-01), Ovshinsky
patent: 4267261 (1981-05-01), Hallman et al.
patent: 4269935 (1981-05-01), Masters et al.
patent: 4312938 (1982-01-01), Drexler et al.
patent: 4316946 (1982-02-01), Masters et al.
patent: 4320191 (1982-03-01), Yoshikawa et al.
patent: 4405710 (1983-09-01), Balasubramanyam et al.
patent: 4419421 (1983-12-01), Wichelhaus et al.
patent: 4499557 (1985-02-01), Holmberg et al.
patent: 4597162 (1986-07-01), Johnson et al.
patent: 4608296 (1986-08-01), Keem et al.
patent: 4637895 (1987-01-01), Ovshinsky et al.
patent: 4646266 (1987-02-01), Ovshinsky et al.
patent: 4664939 (1987-05-01), Ovshinsky
patent: 4668968 (1987-05-01), Ovshinsky et al.
patent: 4670763 (1987-06-01), Ovshinsky et al.
patent: 4671618 (1987-06-01), Wu et al.
patent: 4673957 (1987-06-01), Ovshinsky et al.
patent: 4678679 (1987-07-01), Ovshinsky
patent: 4696758 (1987-09-01), Ovshinsky et al.
patent: 4698234 (1987-10-01), Ovshinsky et al.
patent: 4710899 (1987-12-01), Young et al.
patent: 4728406 (1988-03-01), Banerjee et al.
patent: 4737379 (1988-04-01), Hudgens et al.
patent: 4766471 (1988-08-01), Ovshinsky et al.
patent: 4769338 (1988-09-01), Ovshinsky et al.
patent: 4775425 (1988-10-01), Guha et al.
patent: 4788594 (1988-11-01), Ovshinsky et al.
patent: 4795657 (1989-01-01), Formigoni et al.
patent: 4800526 (1989-01-01), Lewis
patent: 4809044 (1989-02-01), Pryor et al.
patent: 4818717 (1989-04-01), Johnson et al.
patent: 4843443 (1989-06-01), Ovshinsky et al.
patent: 4845533 (1989-07-01), Pryor et al.
patent: 4847674 (1989-07-01), Silwa et al.
patent: 4853785 (1989-08-01), Ovshinsky et al.
patent: 4891330 (1990-01-01), Guha et al.
patent: 5128099 (1992-07-01), Strand et al.
patent: 5159661 (1992-10-01), Ovshinsky et al.
patent: 5166758 (1992-11-01), Ovshinsky et al.
patent: 5177567 (1993-01-01), Klersy et al.
patent: 5219788 (1993-06-01), Abernathey et al.
patent: 5238862 (1993-08-01), Blalock et al.
patent: 5272359 (1993-12-01), Nagasubramanian et al.
patent: 5296716 (1994-03-01), Ovshinsky et al.
patent: 5314772 (1994-05-01), Kozicki
patent: 5315131 (1994-05-01), Kishimoto et al.
patent: 5335219 (1994-08-01), Ovshinsky et al.
patent: 5341328 (1994-08-01), Ovshinsky et al.
patent: 5350484 (1994-09-01), Gardner et al.
patent: 5359205 (1994-10-01), Ovshinsky
patent: 5360981 (1994-11-01), Owen et al.
patent: 5406509 (1995-04-01), Ovshinsky et al.
patent: 5414271 (1995-05-01), Ovshinsky et al.
patent: 5500532 (1996-03-01), Kozicki et al.
patent: 5512328 (1996-04-01), Yoshimura et al.
patent: 5512773 (1996-04-01), Wolf et al.
patent: 5534711 (1996-07-01), Ovshinsky et al.
patent: 5534712 (1996-07-01), Ovshinsky et al.
patent: 5536947 (1996-07-01), Klersy et al.
patent: 5543737 (1996-08-01), Ovshinsky
patent: 5591501 (1997-01-01), Ovshinsky et al.
patent: 5596522 (1997-01-01), Ovshinsky et al.
patent: 5687112 (1997-11-01), Ovshinsky
patent: 5694054 (1997-12-01), Ovshinsky et al.
patent: 5714768 (1998-02-01), Ovshinsky et al.
patent: 5726083 (1998-03-01), Takaishi
patent: 5751012 (1998-05-01), Wolstenholme et al.
patent: 5761115 (1998-06-01), Kozicki et al.
patent: 5789277 (1998-08-01), Zahorik et al.
patent: 5814527 (1998-09-01), Wolstenholme et al.
patent: 5818749 (1998-10-01), Harshfield
patent: 5825046 (1998-10-01), Czubatyj et al.
patent: 5841150 (1998-11-01), Gonzalez et al.
patent: 5846889 (1998-12-01), Harbison et al.
patent: 5851882 (1998-12-01), Harshfield
patent: 5869843 (1999-02-01), Harshfield
patent: 5896312 (1999-04-01), Kozicki et al.
patent: 5912839 (1999-06-01), Ovshinsky et al.
patent: 5914893 (1999-06-01), Kozicki et al.
patent: 5920788 (1999-07-01), Reinberg
patent: 5933365 (1999-08-01), Klersy et al.
patent: 5998066 (1999-12-01), Block et al.
patent: 6011757 (2000-01-01), Ovshinsky
patent: 6031287 (2000-02-01), Harshfield
patent: 6072716 (2000-06-01), Jacobson et al.
patent: 6077729 (2000-06-01), Harshfield
patent: 6084796 (2000-07-01), Kozicki et al.
patent: 6087674 (2000-07-01), Ovshinsky et al.
patent: 6117720 (2000-09-01), Harshfield
patent: 6141241 (2000-10-01), Ovshinsky et al.
patent: 6143604 (2000-11-01), Chiang et al.
patent: 6177338 (2001-01-01), Liaw et al.
patent: 6236059 (2001-05-01), Wolstenholme et al.
patent: RE37259 (2001-07-01), Ovshinsky
patent: 6297170 (2001-10-01), Gabriel et al.
patent: 6300684 (2001-10-01), Gonzalez et al.
patent: 6316784 (2001-11-01), Zahorik et al.
patent: 6329606 (2001-12-01), Freyman et al.
patent: 6339544 (2002-01-01), Chiang et al.
patent: 6348365 (2002-02-01), Moore et al.
patent: 6350679 (2002-02-01), McDaniel et al.
patent: 6376284 (2002-04-01), Gonzalez et al.
patent: 6388324 (2002-05-01), Kozicki et al.
patent: 6391688 (2002-05-01), Gonzalez et al.
patent: 6404665 (2002-06-01), Lowrey et al.
patent: 6414376 (2002-07-01), Thakur et al.
patent: 6418049 (2002-07-01), Kozicki et al.
patent: 6420725 (2002-07-01), Harshfield
patent: 6423628 (2002-07-01), Li et al.
patent: 6429064 (2002-08-01), Wicker
patent: 6437383 (2002-08-01), Xu
patent: 6440837 (2002-08-01), Harshfield
patent: 6462984 (2002-10-01), Xu et al.
patent: 6469364 (2002-10-01), Kozicki
patent: 6473332 (2002-10-01), Ignatiev et al.
patent: 6480438 (2002-11-01), Park
patent: 6487106 (2002-11-01), Kozicki
patent: 6487113 (2002-11-01), Park et al.
patent: 6501111 (2002-12-01), Lowrey
patent: 6507061 (2003-01-01), Hudgens
patent: 6511862 (2003-01-01), Hudgens et al.
patent: 6511867 (2003-01-01), Lowrey et al.
patent: 6512241 (2003-01-01), Lai
patent: 6514805 (2003-02-01), Xu et al.
patent: 6531373 (2003-03-01), Gill et al.
patent: 6534781 (2003-03-01), Dennison
patent: 6545287 (2003-04-01), Chiang
patent: 6545907 (2003-04-01), Lowrey et al.
patent: 6555860 (2003-04-01), Lowrey et al.
patent: 6563164 (2003-05-01), Lowrey et al.
patent: 6566700 (2003-05-01), Xu
patent: 6567293 (2003-05-01), Lowrey et al.
patent: 6569705 (2003-05-01), Chiang et al.
patent: 6570784 (2003-05-01), Lowrey
patent: 6576921 (2003-06-01), Lowrey
patent: 6586761 (2003-07-01), Lowrey
patent: 6589714 (2003-07-01), Maimon et al.
patent: 6590807 (2003-07-01), Lowrey
patent: 6593176 (2003-07-01), Dennison
patent: 6597009 (2003-07-01), Wicker
patent: 6605527 (2003-08-01), Dennison et al.
patent: 6613604 (2003-09-01), Maimon et al.
patent: 6621095 (2003-09-01), Chiang et al.
patent: 6625054 (2003-09-01), Lowrey et al.
patent: 6642102 (2003-11-01), Xu
patent: 6646297 (2003-11-01), Dennison
patent: 6649928 (2003-11-01), Dennison
patent: 6667900 (2003-12-01), Lowrey et al.
patent: 6671710 (2003-12-01), Ovshinsky et al.
patent: 6673648 (2004-01-01), Lowrey
patent: 6673700 (2004-01-01), Dennison et al.
patent: 6674115 (2004-01-01), Hudgens et al.
patent: 6687153 (2004-02-01), Lowrey
patent: 6687427 (2004-02-01), Ramalingam et al.
patent: 6690026 (2004-02-01), Peterson
patent: 6696355 (2004-02-01), Dennison
patent: 6707712 (2004-03-01), Lowery
patent: 6714954 (2004-03-01), Ovshinsky et al.
patent: 2002/0000666 (2002-01-01), Kozicki et al.
patent: 2002/0072188 (2002-06-01), Gilton
patent: 2002/0106849 (2002-08-01), Moore
patent: 2002/0123169 (2002-09-01), Moore et al.
patent: 2002/0123170 (2002-09-01), Moore et al.
patent: 2002/0123248 (2002-09-01),

Affiliated with

Also associated with

Rating

Method of forming integrated circuitry, method of forming... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming integrated circuitry, method of forming..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming integrated circuitry, method of forming... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3485187