Method of manufacturing the multi-tip probe, a multi-tip...

Details Method of manufacturing the multi-tip probe, a multi-tip... Method of manufacturing the multi-tip probe, a multi-tip...

2005-10-11

2005-10-11

McDonald, Rodney G. (Department: 1753)

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

C204S192340, C216S066000, C216S094000, C427S523000, C427S526000, C427S531000, C427S595000

Reexamination Certificate

active

06953519

ABSTRACT:
In order to establish processing techniques capable of making multi-tip probes with sub-micron intervals and provide such microscopic multi-tip probes, there is provided an outermost surface analysis apparatus for semiconductor devices etc. provided with a function for enabling positioning to be performed in such a manner that there is no influence on measurement in electrical measurements at an extremely small region using this microscopic multi-tip probe, and there are provided the steps of making a cantilever1formed with a plurality of electrodes3using lithographic techniques, and forming microscopic electrodes6minute in pitch by sputtering or gas-assisted etching a distal end of the cantilever1using a focused charged particle beam or using CVD.

REFERENCES:
patent: 6668628 (2003-12-01), Hantschel et al.
patent: 09-127139 (1997-05-01), None

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