Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2005-02-01
2005-02-01
Tugbang, A. Dexter (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S843000, C029S854000, C029S860000, C029S832000, C438S107000, C228S180210, C228S180500
Reexamination Certificate
active
06848173
ABSTRACT:
A method of making a microelectronic assembly includes juxtaposing a first element, such as a dielectric sheet having conductive leads thereon with a second element, such as a semiconductor chip, having contact thereon, and wire bonding the conductive leads on the first element to the contacts on the second element so that elongated bonding wires extend between the conductive leads and the contacts. After the wire bonding step, the first and second elements are moved through a pre-selected displacement relative to one another so as to deform the bonding wires. A flowable dielectric material may be introduced between the first and second elements and around the bonding wires during or after the moving step. The flowable material may be cured to form an encapsulant around at least a portion of the bonding wires.
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IBM Technical Disclosure Bulletin, Backto, Back Pack, May 1, 1982, vol. 24, Issuee 12, p. 6371.
Beroz Masud
Fjelstad Joseph
Haba Belgacem
Smith John W.
Lerner David Littenberg Krumholz & Mentlik LLP
Tessera Inc.
Tugbang A. Dexter
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