Semiconductor memory device, nonvolatile memory device and...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S751000, C257S758000, C257S773000, C365S097000, C365S158000, C365S200000

Reexamination Certificate

active

06849888

ABSTRACT:
A semiconductor memory device, a nonvolatile memory device and a magnetic memory device of high reliability are obtained. A semiconductor device as the magnetic memory device includes TMR cells as memory elements, and a stacked interconnection as an interconnection. The stacked interconnection has a first interconnection made of a barrier metal film and a conductor, and a second interconnection made of another barrier metal film and another conductor and stacked on the first interconnection. The stacked interconnection is arranged opposite to the TMR cells. The stacked interconnection is made thicker in the portions facing the TMR cells than in the portions not facing the TMR cells.

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M. Durlam et al., “Nonvolatile RAM based on Magnetic Tunnel Junction Elements”, ISSCC Digest of Technical Papers, TA 7.3, Feb. 2000, pp. 130-131.

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