Method of manufacturing semiconductor device

Details Method of manufacturing semiconductor device Method of manufacturing semiconductor device

2005-10-11

2005-10-11

Nguyen, Ha (Department: 2812)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S587000, C438S597000

Reexamination Certificate

active

06953748

ABSTRACT:
To enhance and/or improve reliability in a method of forming a semiconductor device. An exemplary method of forming a semiconductor device forms a conductive part within a concave portion which is formed in a first surface of a semiconductor substrate. The semiconductor substrate includes an integrated circuit. The method also thins the substrate by removing a part of a second surface of the semiconductor substrate so as to make the conductive part penetrate from the first surface to the second surface, and cuts the semiconductor substrate into pieces. An electric property of the semiconductor substrate is inspected through the conductive part after the conductive part is formed.

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