Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2005-08-02
2005-08-02
Nelms, David (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S668000
Reexamination Certificate
active
06924557
ABSTRACT:
The present invention discloses a semiconductor package, wherein several chips can be packed thereinto. The present invention uses under bump metallurgies or bonding wires to connect the associated circuits of at least two chips in serial or in parallel. At least one slicing path is located between the at least two chips and a substrate is provided with an upper surface and a lower surface in which the upper surface is flip-chip bonded with the at least two chips.
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Advanced Semiconductor Engineering Inc.
Seyfarth Shaw LLP
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