Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2005-11-08
2005-11-08
Blum, David S. (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S724000
Reexamination Certificate
active
06963132
ABSTRACT:
The present invention provides a method of forming an integrated semiconductor device, and the device so formed. An active surface of at least two semiconductor devices, such as semiconductor chips, are temporarily mounted onto an alignment substrate. A support substrate is affixed to a back surface of the devices using a conformable bonding material, wherein the bonding material accommodates devices having different dimensions. The alignment substrate is then removed leaving the devices wherein the active surface of the devices are co-planar.
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Hakey Mark C.
Holmes Steven J.
Horak David V.
Linde Harold G.
Sprogis Edmund J.
Blum David S.
Sabo William D.
Schmeiser Olsen & Watts
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