Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2005-03-22
2005-03-22
Whitehead, Jr., Carl (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S664000, C257S676000, C257S700000
Reexamination Certificate
active
06870250
ABSTRACT:
A chip package structure having a substrate therein for accommodating a die. Power regions supplying power to various control units within the die are grouped together into at least two sections. At least one π filter is used to isolate different power regions on the substrate so that cross interference of noise signals are reduced and stability of the chip is improved. The π filter is positioned close to one of the corners of the substrate so that the layout of wiring on the substrate is facilitated.
REFERENCES:
patent: 6049702 (2000-04-01), Tham et al.
patent: 6124625 (2000-09-01), Chern et al.
patent: 20010024360 (2001-09-01), Hirata et al.
patent: 20010042899 (2001-11-01), Protigal et al.
patent: 7074322 (1993-08-01), None
Huynh Yennhu B.
J.C. Patents
Jr. Carl Whitehead
VIA Technologies Inc.
LandOfFree
Chip package structure having π filter does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Chip package structure having π filter, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chip package structure having π filter will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3458042