Polishing pad conditioning system

Details Polishing pad conditioning system Polishing pad conditioning system

2005-10-25

2005-10-25

Morgan, Eileen P. (Department: 3723)

Abrading

Abrading process

With tool treating or forming

C451S443000, C451S036000, C451S446000

Reexamination Certificate

active

06958005

ABSTRACT:
A pad conditioning system for conditioning a polishing pad in conjunction with a workpiece polishing operation includes a pad conditioning head coupled with a positioning unit. The pad conditioning head includes a plurality of abrasive particles protruding from a surface of the pad conditioning head. The positioning unit is configured to move the surface into contact with a polishing pad. The pad conditioning system also includes a liquid supply nozzle. The liquid supply nozzle is configured to selectively discharge liquid proximate to the abrasive particles that are in contact with the polishing pad to minimize frictional wear of the abrasive particles.

REFERENCES:
patent: 5782675 (1998-07-01), Southwick
patent: 5857899 (1999-01-01), Volodarsky et al.
patent: 5913714 (1999-06-01), Volodarsky et al.
patent: 5913715 (1999-06-01), Kirchner et al.
patent: 6053801 (2000-04-01), Pinson et al.
patent: 6086460 (2000-07-01), Labunsky et al.
patent: 6190236 (2001-02-01), Drill
patent: 6200207 (2001-03-01), Hsu
patent: 6241587 (2001-06-01), Drill et al.
patent: 6283840 (2001-09-01), Huey
patent: 6306019 (2001-10-01), Finkelman
patent: 6306022 (2001-10-01), Tung et al.
patent: 6328637 (2001-12-01), Labunsky et al.
patent: 6336845 (2002-01-01), Engdahl et al.
patent: 6361414 (2002-03-01), Ravkin et al.
patent: 6371838 (2002-04-01), Holzapfel
patent: 6390902 (2002-05-01), Chang et al.
patent: 6530827 (2003-03-01), Mitsuhashi
patent: 6554688 (2003-04-01), Lacy
patent: 6626743 (2003-09-01), Boyd
patent: 6645046 (2003-11-01), Vogtmann et al.
patent: 6648740 (2003-11-01), Perlov et al.
patent: 6695684 (2004-02-01), Park et al.
patent: 6740169 (2004-05-01), Cho et al.
patent: 6752697 (2004-06-01), Stoeckgen et al.
patent: 6773332 (2004-08-01), Moore

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