Semiconductor device including adhesive agent layer with...

Details Semiconductor device including adhesive agent layer with... Semiconductor device including adhesive agent layer with...

2005-05-31

2005-05-31

Zarneke, David (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

Reexamination Certificate

active

06900550

ABSTRACT:
A semiconductor integrated circuit is adhered to the substrate and includes semiconductor integrated circuit electrodes. A hardened adhesive agent layer is formed from an adhesive agent with gradable adhesiveness and has conductor bodies buried therein. The adhesive agent includes a (meth)acrylate copolymer having a weight-average molecular weight of not less than 30,000, an epoxy resin having a weight-average molecular weight of 100 to 10,000, a photopolymerizable low molecular compound and thermal activation latent epoxy resin curing agent. The conductor bodies are connected with the semiconductor integrated circuit electrodes, and the adhesive agent layer is aligned with the substrate so that the conductor bodies buried in the adhesive agent layer and the substrate electrodes are electrically connected.

REFERENCES:
patent: 5110388 (1992-05-01), Komiyama et al.
patent: 5637176 (1997-06-01), Gilleo et al.
patent: 5918113 (1999-06-01), Higashi et al.
patent: 6673441 (2004-01-01), Tanaka et al.

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