Method for forming bump, semiconductor element having bumps...

Details Method for forming bump, semiconductor element having bumps... Method for forming bump, semiconductor element having bumps...

2005-09-20

2005-09-20

Pham, Long (Department: 2814)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S613000, C438S617000

Reexamination Certificate

active

06946380

ABSTRACT:
A tip of a wire formed in the shape of a ball is bonded to an electrode by using a tool. A part of the wire is drawn from the tip bonded to the electrode. A bump is formed on the electrode by deforming a portion of the wire continuous with the tip on the tip by using the tool. The wire is cut while leaving the bump on the electrode.

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