Method of dividing a semiconductor wafer

Details Method of dividing a semiconductor wafer Method of dividing a semiconductor wafer

2005-05-17

2005-05-17

Wilson, Christian (Department: 2824)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having specified scribe region structure

C438S110000, C438S113000, C438S114000, C438S460000, C438S465000, C257S620000, C257S797000

Reexamination Certificate

active

06893943

ABSTRACT:
A method for dividing a semiconductor wafer which is covered by an opaque resin in a dicing process includes forming marks on the semiconductor wafer, wherein the marks are distinguished from electrodes which are formed on the semiconductor wafer. According to the method, in a dicing process, separating semiconductor chips from the semiconductor wafer can be precisely achieved.

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Nikkei Microdevices, pp. 164-167, Apr. 1998.

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