Mask for sequential lateral solidification and...

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S701000, C438S713000, C438S719000, C438S764000, C438S798000

Reexamination Certificate

active

06867151

ABSTRACT:
A method of forming a polycrystalline silicon layer includes: disposing a mask over the amorphous silicon layer, the mask having a plurality of transmissive regions, the plurality of transmissive regions being disposed in a stairstep arrangement spaced apart from each other in a first direction and a second direction substantially perpendicular from the first direction, each transmissive region having a central portion and first and second side portions that are adjacent to opposite ends of the central portion along the first direction, and wherein each of the portions has a length along the first direction and a width along the second direction, and wherein the width of first and second portions decreases away from the central portion along the first direction; irradiating a laser beam onto the amorphous silicon layer a first time through the mask to form a plurality of first irradiated regions corresponding to the plurality of transmissive regions, each first irradiated region having a central portion, and first and second side portions at both sides of the central portion; moving the substrate and the mask relative to one another such that the first side portion of each transmissive region overlaps the central portion of each first irradiated region; and irradiating the laser beam onto the amorphous silicon layer a second time through the mask to form a plurality of second irradiated regions corresponding to the plurality of transmissive regions.

REFERENCES:
patent: 6177301 (2001-01-01), Jung
patent: 6316338 (2001-11-01), Jung
patent: 6326286 (2001-12-01), Park et al.
patent: 6726768 (2004-04-01), Yoon
patent: 6741621 (2004-05-01), Asano
patent: 20020179004 (2002-12-01), Jung
patent: 20020179959 (2002-12-01), Fuji et al.
patent: 20030022421 (2003-01-01), Shimoto et al.
patent: 2001-25694 (2002-11-01), None
patent: 2001-30698 (2002-12-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Mask for sequential lateral solidification and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mask for sequential lateral solidification and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mask for sequential lateral solidification and... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3435391

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.