Lamination and delamination technique for thin film processing

Details Lamination and delamination technique for thin film processing Lamination and delamination technique for thin film processing

2005-09-20

2005-09-20

Ahmad, Nasser (Department: 1772)

Stock material or miscellaneous articles

Layer or component removable to expose adhesive

C206S724000, C428S041300, C428S041900, C428S200000, C428S3550AK, C428S3550EN, C428S913000

Reexamination Certificate

active

06946178

ABSTRACT:
This invention discloses a releasable adhesion layer having good adhesion during high temperature fabrication process in the absence of light, and delaminating at a lower temperature in the presence of light. One embodiment of this invention is a film of polymer whose thermal decomposition temperature changes drastically upon photoexposure. These materials, prior to photoexposure, can withstand temperatures in the range of approximately 200° C. to 300° C. without decomposition, yet decompose at around 100° C. with photoexposure. The releasable adhesion layer can be used in a thermal transfer element, sandwiching a donor substrate and a transfer layer having a plurality of multicomponent transfer units. In the absence of light, the releasable adhesion layer can sustain high temperature processing of these multicomponent transfer units. By photoexposing according to a pattern, the photoexposed multicomponent transfer units can be selectively released at a low temperature to transfer to a receptor.

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