Structure having recesses and projections, method of...

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step

Reexamination Certificate

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C438S746000

Reexamination Certificate

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06878634

ABSTRACT:
A structure having recesses and projections is provided. A method of manufacturing the structure comprises the steps of preparing a first substrate having a projection, forming a first layer on the projection, transferring the first layer to a second substrate, and forming a recessed/projected surface structure in the second substrate by using the first layer.

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