Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed
Reexamination Certificate
2005-05-17
2005-05-17
Smoot, Stephen W. (Department: 2813)
Semiconductor device manufacturing: process
With measuring or testing
Electrical characteristic sensed
C219S209000
Reexamination Certificate
active
06893885
ABSTRACT:
A method and system for locally connecting microstructures and devices formed thereby are provided wherein localized solder-bonding creates bonds between pairs of microstructures found on miniature flexible cables and silicon microsystem platforms. Multi-lead contact to the pads are detected automatically, triggering an embedded heater or heaters to initiate solder melting. This approach enables delicate microstructures to be connected and disconnected from microsystem platforms in the field, and is implemented with a process that is compatible with monolithic integration of circuits.
REFERENCES:
patent: 4099118 (1978-07-01), Franklin et al.
patent: 5786979 (1998-07-01), Douglass
patent: 6054720 (2000-04-01), Fieselman et al.
patent: 6355501 (2002-03-01), Fung et al.
patent: 6423938 (2002-07-01), Murari et al.
Lemmerhirt, David F., et al., Field-Operable Microconnections Using Automatically-Triggered Localized Solder-Bonding, Technical Digest, MEMS 2002 IEEE International Conference on Micro Electro Mechanical Systems, Piscataway New Jersey, pp. 403-406, 2002.
Enikov, Eniko, et al., Electroplated Electro-Fluidic Interconnects For Chemical Sensors, 2000 Elsevier Science S.A. Sensors and Actuators 84, Aug. 1, 2000, pp. 161-164.
Baltes Henry, et al., CMOS-based Microsensors and Packaging, 2001 Elsevier Science, Sensors and Actuators. A 92 pp. 1-9, Aug. 2001.
Lozano, M., et al., Test Structures For MCM-D Technology Characterization, Microelectronic Test Structures, 1998, Proceedings of the 1998 International Conference on Microelectronic Test Structures, vol. 11, Kanazawa, Japan, Mar. 23-26, 1998, New York, New York, IEEE, pp. 183-188.
Cheng, Y.T., et al., Localized Bonding With PSG or Indium Solder as Intermediate Layer, MEMS 1999, pp. 285-289.
Intel Corporation, Intel Flash Memory Chip Scale Package User's Guide, 1999, pp. 1-66.
Harsh, K.F., et al., Study of Micro-Scale Limits of Solder Self-Assembly for MEMS, Electronics Components and Technology Conference, 2000 Proceedings, pp. 1690-1695.
Tartagni, Marco, et al., A 390 DPI Live Fingerprint Imager Based on Feedback Capacitive Sensing Scheme, ISSCC 1997, pp. 200-201, 456.
Lemmerhirt David F.
Wise Kensall D.
Brooks & Kushman P.C.
Smoot Stephen W.
The Regents of the University of Michigan
LandOfFree
Method for electrically and mechanically connecting... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for electrically and mechanically connecting..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for electrically and mechanically connecting... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3419504