Integrated circuit with a transitor over an interconnect layer

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S326000, C257S532000, C257S758000

Reexamination Certificate

active

06838721

ABSTRACT:
An integrated circuit (101) includes electrical circuitry (105) formed on a substrate (103). An interconnect layer (109, 117) is formed over the electrical circuitry (105). In one example, a plurality of magneto-resistive random access memory cells (MRAM) (161, 171) is implemented above the interconnect layer. Each of the MRAM cells comprises a magneto-resistive tunnel junction (MTJ) storage element. A transistor (130) is formed-over the interconnect layer (109, 117). In one embodiment, the transistor is implemented as a thin film transistor (TFT). In one embodiment the transistor is a select transistor and may be coupled to one or more of the MTJ storage elements. Access circuitry (203, 205, 207, 209) is formed on the substrate (103) under the plurality of MRAM cells (161, 171).

REFERENCES:
patent: 6185143 (2001-02-01), Perner et al.
patent: 6242770 (2001-06-01), Bronner et al.
patent: 6256247 (2001-07-01), Perner
patent: 6355950 (2002-03-01), Livengood et al.
patent: 6574130 (2003-06-01), Segal et al.
patent: 6583045 (2003-06-01), Liu et al.
patent: 6664613 (2003-12-01), Tuttle
patent: 20010005019 (2001-06-01), Ishikawa
U.S. patent application S/N 10/185,566 entitled “Sense Amplifier and Method for Performing a Read Operation in a MRAM,” filed Jun. 28, 2002 and assignee hereof.
U.S. patent application S/N 10/331,058 entitled “Method and Apparatus for Compensating Deviation Variances in a 2-Level FSK FM Transmitter,” filed Dec. 27, 2002 and assignee hereof.
Lee et al., “Low-temperature polysilicon TFT with counter-doped lateral body terminal,”Electronics Letters, Feb. 28, 2002, vol. 38, No. 5, pp. 255-256.
Moon et al., “Improvement of Polycrystalline Silicon Thin Film Transistor Using Oxygen Plasma Pretreatment Before Laser Crystallization,”IEEE Transactions on Electron Devices, Jul. 2002, vol. 49, No. 7, pp. 1319-1322.
Rezaee et al., “Low temperature polysilicon growth on glass suitable for TFT fabrication,”The 13th Conference on Microelectronics, Rabat, Morocco, Oct. 29-31, 2001, pp. 79-82.
Sazonov, et al., “Low Temperature a-Si:H TFT on Plastic Films: Materials and Fabrication Aspects,”Proc. 23rd International Conference on Microelectronics(MIEL 2002), Nis, Yugoslavia, May 12-15, 2002, vol. 2, pp. 525-528.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Integrated circuit with a transitor over an interconnect layer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit with a transitor over an interconnect layer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit with a transitor over an interconnect layer will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3418358

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.