Mass production of cross-section TEM samples by focused ion...

Etching a substrate: processes – Etching of semiconductor material to produce an article...

Reexamination Certificate

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Details

C216S048000, C216S052000, C216S060000, C216S079000

Reexamination Certificate

active

06884362

ABSTRACT:
A method of preparing a TEM sample. A focused ion beam is used to deposit a mask on the material to be sampled. Reactive ion etching removes material not protected by the mask, leaving a wall thin enough to be imaged by TEM.

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patent: 06061320 (1994-03-01), None
patent: 07151658 (1995-06-01), None

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