Semiconductor device and manufacturing method of that

Details Semiconductor device and manufacturing method of that Semiconductor device and manufacturing method of that

2005-09-20

2005-09-20

Owens, Douglas W. (Department: 2811)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S106000, C438S107000

Reexamination Certificate

active

06946327

ABSTRACT:
A semiconductor integrated circuit device includes a semiconductor substrate, a circuit element formed on one major surface of the semiconductor substrate and constituting an integrated circuit having a plurality of functions or a plurality of characteristics, an internal connection terminal, connected to the integrated circuit, for selecting one of the plurality of functions or one of the characteristics in the integrated circuit, an insulating layer covering the internal connection terminal such that the internal connection terminal is selectively exposed, and an external connection terminal arranged on the insulating layer. One of the plurality of functions or one of the plurality of characteristics is selected by a connection state between the internal connection terminal and the external connection terminal.

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U.S. Appl. No. 10/250,939, filed Jul. 2003, Katagiri et al.
“Electronics Mount Technology Extra Edition 2000”, Gijyutsu-chyuosa-kai Corp., issued May 28, 2000, pp. 81-113.

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