Abrading – Abrading process – With tool treating or forming
Reexamination Certificate
2005-07-05
2005-07-05
Wilson, Lee D. (Department: 3723)
Abrading
Abrading process
With tool treating or forming
C451S041000, C451S285000, C438S692000
Reexamination Certificate
active
06913523
ABSTRACT:
A method and apparatus for processing a microelectronic substrate. In one embodiment, the method can include planarizing the microelectronic substrate with a planarizing liquid and rinsing the substrate with a rinsing liquid having a pH approximately the same as a pH of the planarizing liquid. The rinsing step can be completed while the substrate remains on a polishing pad of the apparatus, or, alternatively, the substrate can be removed to a rinsing chamber for rinsing. In another embodiment, the method can include conditioning the polishing pad by removing polishing pad material from the polishing pad and then cleaning the microelectronic substrate by engaging the substrate with the same polishing pad and moving at least one of the polishing pad and the substrate relative to the other of the polishing pad and the substrate after conditioning the polishing pad.
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Uematsu et al., “Efficient Mechanochemical Polishing for Silicon Nitride Ceramics”,NIST Spec. Publ.847 , (Machining of Advanced Materials): 409-413, 1993.
Hudson Guy F.
Sharples Judson R.
Zacharias Kenneth F.
Dorsey & Whitney LLP
Micro)n Technology, Inc.
Ojini Anthony
Wilson Lee D.
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