Hybrid invariant adaptive automatic defect classification

Details Hybrid invariant adaptive automatic defect classification Hybrid invariant adaptive automatic defect classification

2005-07-26

2005-07-26

Bali, Vikkram (Department: 2623)

Image analysis

Applications

Manufacturing or product inspection

C382S146000, C382S147000

Reexamination Certificate

active

06922482

ABSTRACT:
A method and apparatus is provided for automatically classifying a defect on the surface of a semiconductor wafer into one of a predetermined number of core classes using a core classifier employing boundary and topographical information. The defect is then further classified into a subclass of arbitrarily defined defects defined by the user with a specific adaptive classifier associated with the one core class and trained to classify defects only from a limited number of related core classes. Defects that cannot be classified by the core classifier or the specific adaptive classifiers are classified by a full classifier.

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Rivi Sherman et al., “An Automatic Defect Classification System for Semiconductor Wafers”,Machine Vision Applications in Industrial Inspection, SPIE vol. 1907, 1993, pp. 72-78.
Louis Breaux et al., “Automatic Defect Classification System for Patterned Semiconductor Wafers”, 1995 International Symposium on Semiconductor Manufacturing., pp. 69-73.1.

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