Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...
Reexamination Certificate
2005-09-20
2005-09-20
Webb, Gregory E. (Department: 1751)
Cleaning compositions for solid surfaces, auxiliary compositions
Cleaning compositions or processes of preparing
For cleaning a specific substrate or removing a specific...
C510S176000, C134S001300, C134S002000, C134S003000
Reexamination Certificate
active
06946431
ABSTRACT:
Cleaning solutions for integrated circuit devices and methods of cleaning integrated circuit devices using the same are disclosed. The cleaning solution includes about 30% aqueous ammonia solution, acetic acid by a volume percent higher then a volume percent of the aqueous ammonia solution, and deionized water by a volume percent higher then the volume percent of the acetic acid. Additionally, disclosed are methods wherein the cleaning solution is formed on integrated circuit substrates having an exposed metal pattern formed thereon, and further providing mega-sonic energy to the film of the cleaning solution.
REFERENCES:
patent: 6399552 (2002-06-01), Lee et al.
patent: 6432826 (2002-08-01), Emami et al.
patent: 60007233 (1985-01-01), None
patent: 1999-57778 (1999-12-01), None
Chung Dae-Hyuk
Hwang In-Seak
Kim Kyung-Hyun
Ko Yong-Sun
Yeo In-Joon
Myers Bigel & Sibley & Sajovec
Samsung Electronics Co,. Ltd.
Webb Gregory E.
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