Method of exposing a semiconductor integrated circuit...

Details Method of exposing a semiconductor integrated circuit... Method of exposing a semiconductor integrated circuit...

2005-07-05

2005-07-05

Nguyen, Ha Tran (Department: 2812)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S942000, C438S949000, C430S312000, C430S494000

Reexamination Certificate

active

06913989

ABSTRACT:
In a semiconductor integrated circuit device including a plurality of semiconductor devices formed on a substrate, the principal plane of the substrate is partitioned into a plurality of device regions and into a plurality of routing regions each crossing a boundary between the plural device regions. A device group including one or more semiconductor devices among the plural semiconductor devices and a local interconnect for connecting the semiconductor devices included in the device group are disposed within the plural device regions. A global routing for connecting the device groups to each other is disposed within each of the plural routing regions.

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