Registers – Records – Conductive
Reexamination Certificate
2005-01-18
2005-01-18
Fureman, Jared J. (Department: 2876)
Registers
Records
Conductive
C257S679000, C257S777000, C174S050510
Reexamination Certificate
active
06843421
ABSTRACT:
An improved memory module and method of manufacture are presented. The memory module takes on the same outer dimensions as conventional memory cards. The memory module includes an integrated circuit and a conductor encased within molded resin. The conductor can be taken from a tape or a lead frame, and can include bumps or wires extending from the conductor to corresponding bonding pads on the integrated circuit. The bonded integrated circuit can thereafter be placed within a cavity formed inside a mold housing, where resin may be injected to form the memory module. The conductor can also be shaped so as to extend on multiple planes from the connection point on or near the bonding pad to an edge connector residing near one edge only of the memory module. The conductor is thereby connected to the integrated circuit and provides slide-in, releasable coupling to a receptor.
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Chhor Khushrav S.
Moresco Larry L.
Daffer Kevin J.
Daffer McDaniel LLP
Fureman Jared J.
Matrix Semiconductor Inc.
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