Flip-chip adaptor package for bare die

Details Flip-chip adaptor package for bare die Flip-chip adaptor package for bare die

2005-03-01

2005-03-01

Brock, II, Paul E (Department: 2815)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S127000

Reexamination Certificate

active

06861290

ABSTRACT:
A board for connecting a bare semiconductor die with a bond pad arrangement which does not conform to a master printed circuit board with a specific or standardized pin out, connector pad, or lead placement arrangement. The board comprises a printed circuit board including first elements, such as minute solder balls, pins, or bond wires, for making electrical contact between the board and the master board, and second elements, such as minute solder balls, pins, or bond wires, for making electrical contact between the semiconductor die and the board. The board has circuit traces for electrical communication between the board/master board electrical contact elements, and the semiconductor die board electrical contact elements.

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