Semiconductor assembly encapsulation mold and method for...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating

Reexamination Certificate

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C438S112000, C257S787000, C257S730000

Reexamination Certificate

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06841424

ABSTRACT:
An encapsulation mold for forming an encapsulation layer over a semiconductor assembly is disclosed. A semiconductor assembly with multiple semiconductor dies secured to a single semiconductor support structure is inserted into an encapsulation mold. The mold contains a first section and a second section, which form a cavity around the assembly. The mold contains an aperture for transferring encapsulating material into the mold cavity. One of the mold sections has a design feature, such as a raised rib or groove interconnecting at approximately the separation or saw-cut regions of the individual dies of the assembly. Encapsulation material is inserted into the mold cavity until the cavity is filled. The mold section design feature shapes the top surface of the encapsulation layer. The mold is removed leaving the exterior surface of the encapsulation layer patterned with the design feature. The assembly is then separated into individual dies along the design feature boundary of the encapsulation layer's exterior surface.

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patent: 20020014693 (2002-02-01), Pollack
patent: 11-87433 (1999-03-01), None
US-2002/0014693 A1, Feb. 2002, Pollack, patent application.

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