Semiconductor wafer surface and method of treating a...

Details Semiconductor wafer surface and method of treating a... Semiconductor wafer surface and method of treating a...

2005-05-24

2005-05-24

Smith, Matthew (Department: 2825)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

Reexamination Certificate

active

06897150

ABSTRACT:
The present invention provides a method of treating a surface of a semiconductor substrate, the surface of the semiconductor substrate including at least any one of a copper region, a copper based region and a copper alloy region, the method comprises the steps of: carrying out an anti-corrosion treatment by exposing the surface of the semiconductor substrate to a solution containing an anti-corrosive agent; and forming a copper-diffusion stopper insulating film over the surface of the semiconductor substrate.

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