Brazing paste for bonding metal and ceramic

Details Brazing paste for bonding metal and ceramic Brazing paste for bonding metal and ceramic

1990-03-07

1991-05-28

Rosenberg, Peter D.

Metal treatment

Compositions

Fluxing

420557, 420563, B23K 3534

Patent

active

050191870

ABSTRACT:
According to the present invention, there is provided an electronic component part comprising (i) a high thermal conductivity ceramic circuit board, (ii) terminal pins located over said circuit board, and (iii) a metal brazing material having metal brazing powder, at least one element selected from the Group IVa elements and a metal having a melting point higher than that of the metal brazing powder, the metal brazing material bonding said board and said pins. According to the present invention, metal, such as input/output terminal pins can very firmly be bonded to ceramic, such as a circuit board, within an atmosphere of, for example, N.sub.2 gas without the scattering of any brazing material in which case, unlike the prior art method, any vacuum furnace is not employed.

REFERENCES:
patent: 4325754 (1982-04-01), Mizuhara
patent: 4767471 (1988-08-01), McLellan
patent: 4797328 (1989-01-01), Boehm

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