Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making named article
Reexamination Certificate
2005-01-11
2005-01-11
McPherson, John A. (Department: 1756)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making named article
C216S002000, C216S039000, C205S070000
Reexamination Certificate
active
06841339
ABSTRACT:
The present invention describes a method for rapidly fabricating a robust 3-dimensional silicon micro-mold for use in preparing complex metal micro-components. The process begins by depositing a conductive metal layer onto one surface of a silicon wafer. A thin photoresist and a standard lithographic mask are then used to transfer a trace image pattern onto the opposite surface of the wafer by exposing and developing the resist. The exposed portion of the silicon substrate is anisotropically etched through the wafer thickness down to conductive metal layer to provide an etched pattern consisting of a series of rectilinear channels and recesses in the silicon which serve as the silicon micro-mold. Microcomponents are prepared with this mold by first filling the mold channels and recesses with a metal deposit, typically by electroplating, and then removing the silicon micro-mold by chemical etching.
REFERENCES:
patent: 6242163 (2001-06-01), Stampfl et al.
patent: 6551849 (2003-04-01), Kenney
patent: 1262460 (2000-08-01), None
Becker, E.W.; Ehrfeld, W.; Hagmann, P.; Maner, A.; Muenchmeyer, D.; “Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA process),”Microelectronic Engineering,vol. 4 (1986) pp. 35-56 Published by Elsevier Scientific Publishers B.V.
Ehrfeld, W.; Glashauser, W.; Muenchmeyer, D.; Schelb, W.; “Mask making for synchrotron radiation light,”Microelectronic Engineering,vol. 5 (1986) pp. 463-470 Published by Elsevier Scientific Publishers B.V.
Ehrfeld, W.; Lehr, H.; “Deep x-ray lithography for the production of three-dimensional microstructures from metals, polymers, and ceramics,”Radiat. Phys. Chem.,vol. 45 No. 3 (1995) pp. 349-365 Published by Pergamon Press, Elsevier Scientific Ltd.
Bhardwaj, J.K.; Ashraf, H.; “Advanced silicon etching using high density plasmas”Proceedings of SPIEvol. 2639 (1996) pp. 224-233 Published by SPIE—The International Society for Optical Engineering.
Ajmera, P.K.; Stadler, S.; Abdollahi, N.; “Development of a low-cost X-ray mask for high-aspect ratio MEM smart structures”Proceedings of SPIEvol. 3328 (1998) pp. 14-22 Published by SPIE—The International Society for Optical Engineering.
Shew, B.-Y.; Cheng, Y.; Shih, W.-P.; Lu, M.; Lee, W.H.; “High precision, low cost mask for deep x-ray lithography”Microsystems Technology,vol. 4 (1998) pp. 66-69 Published by Springer—Verlag.
Klein, J.; Guckel, D.P.; Siddons, D.J.; Johnson, E.D.; “X-ray masks for very deep X-rGy lithography”Microsystems Technology,vol. 4 (1998) pp. 70-73 Published by Springer—Verlag.
Sheu, J.T.; Chiang, S.; Su, S.; “Fabrication of intermediate mask for deep x-ray lithography”Microsystems Technology,vol. 4 (1998) pp. 74-76 Published by Springer—Verlag.
Chen, D.; Zhang, D.; Ding, G.; Zhao, X.; Zhang, J.; Yang, C.; Cai, B.; “DEM technique: A new three-dimensional micro fabrication technique for non-silicon materials”Proceedings of SPIEvol. 3680 No. 2 (1999) pp. 1099-1104 Published by SPIE—The International Society for Optical Engineering.
Harris, C.; Desta, Y.; Kelly, K.W.; Calderon, G.; “Inexpensive, quickly producable X-ray mask for LIGA”Microsystems Technology,vol. 5 (1999) pp. 189-195 Published by Springer—Verlag.
Coane, P.; Giasolli, R.; Ledger, S.; Lain, K.; Ling, Z.; Goettert, J.; “Fabrication of HARM structures by deep X-ray lithography using graphite mask technology”Microsystems Technology,vol. 6 (2000) pp. 94-98 Published by Springer—Verlag.
Chen, D.; Lei, W.; Wang, C.; Li, C.; Guo, X.; Mao, H.; Zhang, D.; Yi, F.; “New type of X-ray mask fabricated using inductively coupled plasma deepetching”Microsystems Technology,vol. 7 (2001) pp. 71-74 Published by Springer—Verlag.
Evans Timothy P.
McPherson John A.
Sandia National Laboratories
LandOfFree
Silicon micro-mold and method for fabrication does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Silicon micro-mold and method for fabrication, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Silicon micro-mold and method for fabrication will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3379353