Environmental control equipment/method of developing...

Details Environmental control equipment/method of developing... Environmental control equipment/method of developing...

2005-05-24

2005-05-24

Smoot, Stephen W. (Department: 2813)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Insulative material deposited upon semiconductive substrate

C096S111000, C454S187000

Reexamination Certificate

active

06897165

ABSTRACT:
Environmental control equipment is provided for a developing apparatus for developing a light-exposed resist film with a developer in a wafer treating chamber. An air supply means, supplying air taken from outside into the wafer treating chamber, includes a chemical contaminant removal means for removing chemical contaminants from the air.

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Hitachi Plant Technical Report, 1992, vol. 13.
11thAir Cleaning and Contamination Control Research Conference (C-13) Examination for Filter for Removing Harmful Gas that Influences Wafer (Second Report), 1992.
A. Saiki et al., “Clean Room Technology for Halfmicron LSI,” Hitaci Hyoron, vol. 73, No. 9, 1991, pp. 83-90.

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