Method of forming gas dielectric with support structure

Details Method of forming gas dielectric with support structure Method of forming gas dielectric with support structure

2005-04-05

2005-04-05

Smoot, Stephen W. (Department: 2813)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S624000, C438S634000, C438S639000

Reexamination Certificate

active

06875685

ABSTRACT:
A method for forming a gas dielectric with support structure on a semiconductor device structure provides low capacitance and adequate support for a conductor of the semiconductor device structure. A conductive structure, such as via or interconnect, is formed in a wing-layer dielectric. A support is then formed that connects to the conductive structure, the support including an area thereunder. The wiring-layer dielectric is then removed from the area to form a gas dielectric.

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