Design method for multilayer wiring board

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design

Reexamination Certificate

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C716S030000, C716S030000

Reexamination Certificate

active

06886151

ABSTRACT:
A method of routing in a multilayer wiring board, such as a built-up wiring board, which is interconnected by via holes between only adjacent layers includes steps of reading a parameter for each kind of built-up via of a multilayer wiring board, and setting a via hole size, shift direction, and via pitch of each layer. The information of the read parameter is stored in a memory. In a routing step, wirings of the multilayer wiring board having a built-up via is designed based on the information of the parameter stored in the memory in the parameter reading step, and an instruction for a start layer and a last layer.

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Shimoto et al., “New High-Density Multilayer Technology on PCB”, May 1999, IEEE Transactions on Advanced Packaging, vol. 22, iss. 2, pp. 116-122.

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