Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Diffusing a dopant
Reexamination Certificate
2005-03-29
2005-03-29
Jackson, Jerome (Department: 2815)
Semiconductor device manufacturing: process
Introduction of conductivity modifying dopant into...
Diffusing a dopant
C438S522000, C438S537000, C438S573000, C438S580000
Reexamination Certificate
active
06872644
ABSTRACT:
A semiconductor device includes source and drain contact regions which include a non-compounded combination of a semiconductor material and at least one metal. The metal may include an elemental metal, such as gold or aluminum, or may include an intermetallic. The contact regions may be formed by depositing a limited amount of the at least one metal on a source and a drain of the device, and annealing the device to induce diffusion of the at least one metal into the source and drain. The annealing time and temperature may be selected to limit diffusion of the at least one metal.
REFERENCES:
patent: 4040073 (1977-08-01), Luo
patent: 4348802 (1982-09-01), Shirato
patent: 4432008 (1984-02-01), Maltiel
patent: 5001082 (1991-03-01), Goodwin-Johansson
patent: 5516725 (1996-05-01), Chang et al.
patent: 5543342 (1996-08-01), Mukai et al.
patent: 6037233 (2000-03-01), Liu et al.
patent: 6329274 (2001-12-01), Inoue et al.
patent: 6337250 (2002-01-01), Furuhata
patent: 6525381 (2003-02-01), Long et al.
patent: 6545326 (2003-04-01), Fukada et al.
Buynoski Matthew S.
Maszara Witold P.
Advanced Micro Devices , Inc.
Fenty Jesse A.
Jackson Jerome
Renner , Otto, Boisselle & Sklar, LLP
LandOfFree
Semiconductor device with non-compounded contacts, and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device with non-compounded contacts, and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device with non-compounded contacts, and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3368103