Trench MOSFET with increased channel density

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S332000, C257S923000, C438S212000, C438S270000, C438S271000

Reexamination Certificate

active

06818946

ABSTRACT:

BACKGROUND OF THE INVENTION
Trench power MOSFET devices are used in many applications including power supplies, battery chargers, computers, and cell phones. An important aspect to a trench power MOSFET device is its channel density and on-state resistance (R
DS(ON)
). An increase in channel density decreases R
DS(ON)
. A lower R
DS(ON)
results in a reduction in the total resistance encountered by a drain current flowing from the drain terminal to the source terminal of the power MOSFET device.
Trench power MOSFET devices have a source contact region, and an inter-layer dielectric (ILD) on the top surface of the device which requires a relatively large spacing between the device trenches. A large spacing between trenches limits the cell density of the device. Further reduction in cell size typically requires advanced manufacturing schemes thereby increasing device cost. The limit in the cell density also limits a reduction in R
DS(ON)
.
Thus, a need exists for a trench power MOSFET device that has an increased cell density thereby reducing R
DS(ON)
of the device.


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patent: 6274437 (2001-08-01), Evans

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