Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1991-02-25
1992-07-14
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
73517R, 156643, 156647, 156651, 156657, 1566591, 156662, 357 69, H01L 21306, H01L 2348, B44C 122, G01P 1508
Patent
active
051299836
ABSTRACT:
A method of fabrication of micromechanical devices enables the production of large area micromechanical transducer structures which are symmetric, stress balanced structures relatively devoid of geometric distortions. Micromechanical transducer structures are fabricated implementing processes and physical characteristics which overcome the unbalanced stresses occurring in high concentration diffusion planar structures that cause problematic geometric distortions that restrict physical size. Large increases in the practical size of micromechanical devices which may be fabricated are achieved while permitting greater depths of structural features, without the resultant concentration and stress distortions. Multilevel, balanced stress structures can be created which are of varying geometries at each level to produce a "sculpted" structure.
REFERENCES:
patent: 3053095 (1962-09-01), Koril et al.
patent: 3251231 (1966-05-01), Hunt et al.
patent: 3370458 (1968-02-01), Dillon
patent: 3913035 (1975-10-01), Havens
patent: 4044305 (1977-08-01), Oberbeck
patent: 4149375 (1979-04-01), Wynosky et al.
patent: 4209993 (1980-07-01), Rannenberg
patent: 4234666 (1980-11-01), Gursky
patent: 4321500 (1982-03-01), Paros et al.
patent: 4342227 (1982-08-01), Petersen et al.
patent: 4374469 (1983-02-01), Rannenberg
patent: 4381672 (1983-05-01), O'Connor et al.
patent: 4401269 (1983-08-01), Eiler
patent: 4406992 (1983-09-01), Kurtz et al.
patent: 4411741 (1983-10-01), Janata
patent: 4430867 (1984-02-01), Warner
patent: 4447753 (1984-05-01), Ochiai
patent: 4468584 (1984-08-01), Nakamura et al.
patent: 4478076 (1984-10-01), Bohrer
patent: 4478077 (1984-10-01), Bohrer et al.
patent: 4483194 (1984-11-01), Rudolf
patent: 4484382 (1984-11-01), Kawashima
patent: 4490772 (1984-12-01), Blickstein
patent: 4495499 (1985-01-01), Richardson
patent: 4499778 (1985-02-01), Westhaver et al.
patent: 4502042 (1985-02-01), Wuhrl et al.
patent: 4522072 (1985-06-01), Sulouff et al.
patent: 4524619 (1985-06-01), Staudte
patent: 4538461 (1985-09-01), Juptner et al.
patent: 4585083 (1986-04-01), Nishiguchi
patent: 4592242 (1986-06-01), Kempas
patent: 4596158 (1986-06-01), Strugach
patent: 4598585 (1986-07-01), Boxenhorn
patent: 4600934 (1986-07-01), Aine et al.
patent: 4614119 (1986-09-01), Zavracky et al.
patent: 4619001 (1986-10-01), Kane
patent: 4621925 (1986-11-01), Masuda et al.
patent: 4628283 (1986-12-01), Reynolds
patent: 4629957 (1986-12-01), Walters et al.
patent: 4639690 (1987-01-01), Lewis
patent: 4644793 (1987-02-01), Church
patent: 4651564 (1987-03-01), Johnson et al.
patent: 4653326 (1987-03-01), Danel et al.
patent: 4654663 (1987-03-01), Alsenz et al.
patent: 4665605 (1987-05-01), Kempas
patent: 4670092 (1987-06-01), Motamedi
patent: 4671112 (1987-06-01), Kimura et al.
patent: 4674180 (1987-06-01), Zavracky et al.
patent: 4674319 (1987-06-01), Muller et al.
patent: 4679434 (1987-07-01), Stewart
patent: 4680606 (1987-07-01), Knutti et al.
patent: 4699006 (1987-10-01), Boxenhorn
patent: 4705659 (1987-11-01), Bernstein et al.
patent: 4706374 (1987-11-01), Murakami
patent: 4712439 (1987-12-01), North
patent: 4736629 (1988-04-01), Cole
patent: 4743789 (1988-05-01), Puskas
patent: 4744248 (1988-05-01), Stewart
patent: 4744249 (1988-05-01), Stewart
patent: 4747312 (1988-05-01), Herzl
patent: 4750364 (1988-06-01), Kawamura et al.
patent: 4764244 (1988-08-01), Chitty et al.
patent: 4776924 (1988-10-01), Delapierre
patent: 4783237 (1988-11-01), Aine et al.
patent: 4789803 (1988-12-01), Jacobsen et al.
patent: 4792676 (1988-12-01), Hojo et al.
patent: 4805456 (1989-02-01), Howe et al.
patent: 4808948 (1989-02-01), Patel et al.
patent: 4835961 (1989-06-01), Presz, Jr. et al.
patent: 4851080 (1989-07-01), Howe et al.
patent: 4855544 (1989-08-01), Glenn
patent: 4869107 (1989-09-01), Murakami et al.
patent: 4882933 (1989-11-01), Petersen et al.
patent: 4884446 (1989-12-01), Ljung
patent: 4890812 (1990-01-01), Chechile et al.
patent: 4893509 (1990-01-01), MacIver et al.
patent: 4899587 (1990-02-01), Staudte
patent: 4900971 (1990-02-01), Kawashima
patent: 4901586 (1990-02-01), Blake et al.
patent: 4916520 (1990-04-01), Kurashima
patent: 4971768 (1990-11-01), Ealba et al.
patent: 4981552 (1991-01-01), Mikkor
patent: 5001383 (1991-03-01), Kawashima
patent: 5016072 (1991-05-01), Greiff
patent: 5045152 (1991-09-01), Sickafus
"A Vibratory Micromechanical Gyroscope", Boxenhorn et al., AIAA Guidance, Navigation and Control Conference, Aug. 15-17, 1988, pp. 1033-1040.
"Monolithic Silicon Accelerameter", Boxenhorn et al., Transducers '89, Proceedings of the 5th Int'l Conference on Solid-State Sensors . . . , Jun. 25-30, 1989, pp. 273-277.
"An Electrostatically Rebalanced Micromechanical Accelerometer" Boxenhorn et al., AIAA Guidance, Navigation and Control Conference, Aug. 14-16, 1989, pp. 118-122.
"The Micromechanical Inertial Guidance System and Its Application", Boxenhorn et al., 14th Biennial Guidance Test Symposium, Oct. 3-5, 1989, pp. 113-131.
"Tensometric Accelerometers With Overload Protection", Moskalik, Meas. Tech., (USA), vol. 22, No. 12, (May 1980), pp. 1469-1471.
"Micromechanical Accelerometer Integrated with MOS Detection Circuitry", Petersen et al., IEEE Transactions on Electron Devices, vol. ED-29, No. (Jan. 1982), pp. 23-27.
"Quartz Rate Sensor Replaces Gyros", Defense Electronics, Nov. 1984, p. 177.
"A Monolithic Silicon Accelerometer with Integral Air Damping and Overrange Protection", Barth et al., IEEE 1988, pp. 35-38.
"Silicon as a Mechanical Material", Peterson et al., Proceedings of the IEEE, vol. 70, No. 5, May 1982, pp. 420-457.
"Machining in the Micro Domain", Rosen, Mechanical Engineering, Mar. 1989, pp. 40-46.
"Silicon Micromechanics: Sensors and Actuators on a Chip", Howe et al., IEEE Spectrum, Jul. 1990, pp. 29-35.
M. Nakamura et al., "Novel Electromechanical Micro-Machining and its Application for Semiconductor Acceleration Sensor IC", Digest of Technical Papers (1987), Institute of Electrical Engineers of Japan, pp. 112-115.
Powell William A.
The Charles Stark Draper Laboratory Inc.
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