Pad protection diode structure

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257356, 257362, 257546, H01L 2362

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active

057082898

ABSTRACT:
A protection structure and method are provided for protecting a first pad of an integrated circuit, the integrated circuit having a second pad to receive a first supply voltage. The protection structure includes a first region of a first conductivity type coupled to the first pad; a second region of a second conductivity type coupled to the second pad; a substrate of the second conductivity type contacting the first and second regions; and an epitaxial layer of the first conductivity type. The epitaxial layer has an epitaxial region that contacts the first and second regions. A first diode can be formed outside the substrate between the first and second pads through at least two of the first region, the second region, and the epitaxial region. The protection structure may include a first portion and a second portion, wherein each portion has a different voltage threshold. Accordingly, the first diode can be formed through the second portion, but not the first portion. Hence, the protection structure will not cause interference to a sensitive component adjacent the first portion.

REFERENCES:
patent: 4736271 (1988-04-01), Mack et al.
French Search Report from French Patent Application 92 08280, filed Jun. 25, 1992.
International Electron Devices Meeting, Dec. 1990, San Francisco, CA US, pp. 799-802, XP279627, M.P. Masaquelier et al., "Method Of Internal Overvoltage Protection and Current Limit For A Lateral PNP Transistor Formed by Polysilicon Self-Aligned Emitter and Base, with Extended Collector".
Patent Abstracts of Japan, vol. 13, No. 220 (E-762) (2568) May 23, 1989, & JP-A-10 32 66 Mitsubishi Feb. 2, 1989.

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