Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1995-12-18
1998-01-13
Breneman, R. Bruce
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
1566361, 156345, 216 88, 451 41, 451287, 51295, B24B 100
Patent
active
057074925
ABSTRACT:
A chemical-mechanical-polishing (CMP) process in which a metal interconnect material (47) is polished to form a metal plug (48) includes the application of titanium to the surface of a polishing pad (14) of a polishing apparatus (10). Titanium metal is applied to the surface of the polishing pad (14) by either abrasively applying titanium by use of a titanium block (32) attached to a rotating disk (26), or by a titanium body (23, 25) integrated with a carrier ring (23). Alternatively, titanium can be applied by impregnating a felt layer (52) with titanium particles (56), or by adding titanium directly to the polishing slurry (50).
REFERENCES:
patent: 3715842 (1973-02-01), Tredinnick et al.
patent: 3916584 (1975-11-01), Howard et al.
patent: 4022625 (1977-05-01), Shelton
patent: 4244775 (1981-01-01), D'Asaro
patent: 4466218 (1984-08-01), Ottman et al.
patent: 4910155 (1990-03-01), Cote et al.
patent: 4951427 (1990-08-01), St. Pierre
patent: 4959113 (1990-09-01), Roberts
patent: 5177908 (1993-01-01), Tuttle
patent: 5192339 (1993-03-01), Hasegawa et al.
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5264010 (1993-11-01), Brancaleoni et al.
patent: 5314512 (1994-05-01), Sexton
patent: 5336280 (1994-08-01), Dubots et al.
patent: 5525135 (1996-06-01), Moltgen et al.
patent: 5525191 (1996-06-01), Maniar et al.
Steigerwald, J. M. et al., "Effect of Copper Ions in the Slurry on the Chemical-Mechanical Polish Rate of Titanium", J. Electrochem, Soc., vol. 141, No. 12, Dec. 1994, pp. 3512-3516.
Perry et al, Chemical Engineers Handbook, McGraw Hill Book Co., 5th ed., pp. 23-51, 1973.
Kobayashi Thomas S.
Page Joseph E.
Stager Charles W.
Winebarger Paul M.
Zaleski Mark A.
Alanko Anita
Breneman R. Bruce
Motorola Inc.
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