Semiconductor memory

Static information storage and retrieval – Read/write circuit – Data refresh

Reexamination Certificate

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C365S189070, C365S194000

Reexamination Certificate

active

06741516

ABSTRACT:

BACKGROUND OF THE INVENTION
(1) Field of the Invention
This invention relates to a semiconductor memory and, more particularly, to a semiconductor memory of a dynamic random access memory (DRAM) type having an asynchronous static random access memory (SRAM) interface.
(2) Description of the Related Art
In recent years, attention has been riveted to DRAMs (pseudo SRAMs) having an asynchronous SRAM interface because of low power consumption, the feasibility of large storage capacity, cheapness, and so on.
For example, Japanese Patent Laid-Open Publication No. 2002-118383 discloses a synchronous pseudo SRAM which performs refresh operation internally and automatically.
FIG. 7
is a view showing the structure of a conventional semiconductor memory of a pseudo SRAM type.
A semiconductor memory
20
comprises an ATD generation circuit
21
, a REF control circuit
22
, a REF-ACT comparison circuit
23
, delay circuits
24
a
and
24
b
, a latch signal generation circuit
25
, REF-add counters
26
, input buffers
27
, row-add latch circuits
28
, column-add latch circuits
29
, a core control circuit
30
, and a memory cell array (Hereinafter referred to as core circuit)
31
.
The ATD generation circuit
21
detects a change in external signal (/CE, /WE, /OE, or ADD) and generates an active request signal atdpz indicative of, for example, a read/write request. In this case, /CE, /WE, /OE, and ADD are a chip enable signal, write enable signal, output enable signal, and address signal, respectively, and are external signals.
The REF control circuit
22
includes a timer (not shown) and generates a refresh request signal srtz for periodically performing refresh operation.
The REF-ACT comparison circuit
23
compares a refresh request signal srtz and an active request signal atdpz. If the refresh request signal srtz was input prior to the active request signal atdpz, then the REF-ACT comparison circuit
23
outputs a refresh execution request signal refpz. If the active request signal atdpz was input prior to the refresh request signal srtz, then the REF-ACT comparison circuit
23
outputs an active execution request signal actpz.
The delay circuits
24
a
and
24
b
delay an active execution request signal actpz and a refresh execution request signal refpz, respectively, by time taken to define an internal address in the core circuit
31
.
The latch signal generation circuit
25
outputs an external address import signal ealz in response to an active execution request signal actpz and outputs a refresh address import signal ialz in response to a refresh execution request signal refpz.
The REF-add counters
26
count up to automatically generate a refresh address rfa##z.
An address signal ADD specified by an active request is input to the input buffers
27
from the outside and the input buffers
27
output it as an external address a##z.
The row-add latch circuits
28
specify a row address in the direction of word lines (not shown) in the core circuit
31
.
The column-add latch circuits
29
specify a column address in the direction of column lines (not shown) in the core circuit
31
.
The core control circuit
30
controls the core circuit
31
with a core control signal corez.
The core circuit
31
is a memory cell array of a DRAM type.
FIG. 8
is a circuit diagram of a conventional REF-ACT comparison circuit.
The REF-ACT comparison circuit
23
includes inverters
300
through
310
, NAND circuits
320
through
329
, a pulse width expansion section
330
, and delay circuits
331
through
333
. The NAND circuits
321
and
322
,
323
and
324
,
325
and
326
, and
327
and
328
makeup flip-flops FF
10
, FF
11
, FF
12
, and FF
13
respectively. An active request signal atdpz is input to the pulse width expansion section
330
via the inverter
300
. The pulse width of the active request signal atdpz is expanded here so that a period during which the active request signal atdpz is at the high level (H level) will match a period during which a core control signal corez output from the core control circuit
30
is at the H level, and is input to one input terminal of the NAND circuit
320
. The core control signal corez is input to the other input terminal of the NAND circuit
320
via the inverter
301
.
A refresh request signal srtz is input via the inverter
302
to one input terminal of the NAND circuit
321
included in the flip-flop FF
10
, and output from the NAND circuit
321
is input to one input terminal of the NAND circuit
324
included in the flip-flop FF
11
. Output from the NAND circuit
324
is output as a refresh execution request signal refpz via the inverter
303
. Moreover, output from the inverter
303
is delayed by the delay circuit
331
and is input via the inverter
304
to one input terminal of the NAND circuit
322
included in the flip-flop FF
10
.
Furthermore, the output from the inverter
303
is input via the inverter
305
to one input terminal of the NAND circuit
325
included in the flip-flop FF
12
. The core control signal corez output from the core control circuit
30
is input to one input terminal of the other NAND circuit
326
included in the flip-flop FF
12
. Output from the NAND circuit
325
, being output from the flip-flop FF
12
, is output as a refresh execution signal refz via the inverters
306
and
307
. Moreover, output from the inverter
306
is input to one input terminal of the NAND circuit
329
.
The active request signal atdpz is input to the delay circuit
332
via the inverter
308
, is delayed by the delay circuit
332
, and is input to one input terminal of the NAND circuit
327
included in the flip-flop FF
13
. Output from the NAND circuit
327
, being output from the flip-flop FF
13
, is input to the other input terminal of the NAND circuit
329
. Output from the NAND circuit
329
is output as an active execution request signal actpz via the inverter
309
. Moreover, output from the inverter
309
is input to the delay circuit
333
, is delayed there, and is input via the inverter
310
to one input terminal of the NAND circuit
328
included in the flip-flop FF
13
.
The delay circuit
331
, inverter
304
, and flip-flop FF
10
shown in
FIG. 8
are used for obtaining predetermined pulse width. The same applies to the delay circuit
333
, inverter
310
, and flip-flop FF
13
.
Now, operation in the conventional semiconductor memory
20
will be described with
FIGS. 7 and 8
.
FIG. 9
is a timing chart for describing operation performed in the conventional semiconductor memory in the case of refresh operation being performed prior to active operation.
Each arrow in
FIG. 9
indicates a signal which changes in response to the rise or fall of another signal.
For example, when a chip enable signal /CE, being an external signal, is input to the ATD generation circuit
21
, the ATD generation circuit
21
generates an active request signal atdpz. As shown in
FIG. 9
, in this case, the REF control circuit
22
generates a refresh request signal srtz before the active request signal atdpz is generated. The refresh request signal srtz and active request signal atdpz are input to the REF-ACT comparison circuit
23
.
The refresh request signal srtz is at the H level, so potential at one input terminal of the NAND circuit
324
included in the flip-flop FF
11
in the REF-ACT comparison circuit
23
becomes the H level. When the refresh request signal srtz goes into the H level, the active request signal atdpz and a core control signal corez are at the low level (L level). As a result, potential at one input terminal of the NAND circuit
323
included in the flip-flop FF
11
becomes the L level. Therefore, output from the flip-flop FF
11
goes into the L level and a refresh execution request signal refpz goes into the H level.
When the refresh execution request signal refpz goes into the H level, the latch signal generation circuit
25
generates a refresh address import signal ialz. Then a refresh address rfa##z is imported from the REF-add counters
26
and a row address ra##z where the core con

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