Method and apparatus for transferring test data from a...

Error detection/correction and fault detection/recovery – Data processing system error or fault handling – Reliability and availability

Reexamination Certificate

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Details

C714S100000, C714S718000, C365S201000, C365S189050

Reexamination Certificate

active

06519719

ABSTRACT:

TECHNICAL FIELD
The present invention relates to integrated memory devices and more particularly to data transfer in memory devices.
BACKGROUND OF THE INVENTION
Within a high-speed memory system
38
, shown in
FIG. 1
, a synchronous memory device
40
performs operations, such as reading from or writing to a memory array
46
, in a predetermined sequence. These operations are generally performed responsive to commands COM issued by a command generator, such as a memory controller
44
. Timing of the commands and other signals outside of the memory device
40
is determined by an external clock signal CKEXT and a data clock DCLK that are produced by the memory controller
44
.
It will be understood by one skilled in the art that the block diagram of
FIG. 1
omits some signals applied to the memory device
40
for purposes of brevity. Also, one skilled in the art will understand that although in the exemplary embodiment disclosed herein, the commands COM are control data within a control data packet, in other applications the commands may be composed of a combination of command signals. In either case, the control data or combination of signals is commonly referred to as a command. The exact nature of these packets or signals will depend on the nature of the memory device
40
, but the principles explained herein are applicable to many types of memory devices, including packetized DRAMs and other synchronous DRAMs.
Within the memory device
40
, operations are controlled by a logic control circuit
42
responsive to the commands COM. In the packetized memory system
38
of
FIG. 1
, the logic control circuit
42
includes a command sequencer and decoder
45
and command latches
50
. In a conventional memory system, the logic control circuit
42
may be conventional DRAM control logic.
Timing of operations within the memory device
40
is controlled by an internal clock signal CKINT that is produced by a delay-locked loop
62
and a switching circuit
63
responsive to the external clock signal CKEXT. Timing of data being latched into the memory device
40
is controlled by a write latch signal LATCHW produced by a pulse generator
61
responsive to the data clock DCLK. Data is transferred out of the memory device
40
through an output circuit
81
responsive to an internal read latch signal LATCHR.
Usually, operations within the memory device
40
must be synchronized to operations outside of the memory device
40
. For example, commands and data are transferred into the memory device
40
on command and data busses
48
,
49
, respectively, by clocking a command latch/buffer
50
and input data latches
52
according to the internal clock signal CKINT and the internal write latch signal LATCHW. However, as noted above, command timing on the command bus
48
and data timing on the data bus
49
are controlled by the external clock signal CKEXT and the data clock DCLK, respectively. Therefore, to transfer commands and data from the busses
48
,
49
at the proper times relative to the external clock signal CKEXT, the internal clock signal CKINT is synchronized to the external clock signal CKEXT and the write latch signal LATCHW is synchronized to the data clock DCLK.
To establish synchronization of the internal and external timing, the memory device
40
produces several phase-shifted clock signals CKINT−&phgr;
x
at respective taps of the delay-locked loop
62
responsive to the external clock signal CKEXT. Each of the phase-shifted clock signals CKINT−&phgr;
x
has a respective phase-shift &phgr;
x
relative to the external clock signal CKEXT. In response to commands COM from the memory controller
44
, the logic control circuit
42
activates the switching circuit
63
to select one of the phase-shifted clock signals CKINT−&phgr;
1
as the internal clock signal CKINT. The selected phase-shifted clock signal CKINT−&phgr;
1
has a phase-shift&phgr;
1
corresponding to delays within the memory device
40
and propagation delays of the external clock signal CKEXT. Because the shifted internal clock signal CKINT−&phgr;
1
is synchronized to the external clock signal CKEXT, operations within the memory device
40
can be synchronized to commands and data arriving on the command bus
48
and data bus
49
.
The command packet contains control and address information for each memory transfer, and a command flag signal CDFLAG identifies the start of a command packet which may include more than one 10-bit packet word. In fact, a command packet is generally in the form of a sequence of 10-bit packet words on the 10-bit command bus
48
. The command latch/buffer
50
receives the command packet from the bus
48
, and compares at least a portion of the command packet to identifying data from an ID register
47
to determine if the command packet is directed to the memory device
40
or some other memory device. If the command buffer determines that the command packet is directed to the memory device
40
, it then provides a command word to the command decoder and sequencer
45
. The command decoder and sequencer
45
generates a large number of internal control signals to control the operation of the memory device
40
during a memory transfer.
An address capture/sequencer/refresh circuit
51
also receives the command words from the command bus
48
and produces a 3-bit bank address, a 10-bit row address, and a 7-bit column address corresponding to address information in the command or to addresses from a refresh counter (not shown).
One of the problems of conventional DRAMs is their relatively low speed resulting from the time required to precharge and equilibrate circuitry in the DRAM array. The packetized DRAM
40
shown in
FIG. 2
largely avoids this problem by using a plurality of memory banks
46
, in this case eight memory banks
46
a-h
. After a memory is read from one bank
46
, the bank
46
can be precharged while the remaining banks
46
b-h
are being accessed. Each of the memory banks
46
a-h
receive a row address from a respective row latch/decoder/driver
59
a-h
. All of the row latch/decoder/drivers
59
a-h
receive the same row address from the address capture/sequencer/refresh circuit
51
. However, only one of the row latch/decoder/drivers
46
a-h
is active at any one time as determined by bank control logic
65
as a function of bank data from the address capture/sequencer/refresh circuit
51
.
The 7-bit column address is applied to a column latch/decoder
66
which supplies I/O gating signals to an I/O interface
54
. The I/O interface
54
interfaces with columns of the memory banks
46
a-h
through sense amplifiers
75
.
To write data to the memory device
40
, data are received at a latching circuit
52
responsive to the write latch signal LATCHW. The data are then transferred to a write latch/register
53
where the data are made available to the I/O interface
54
. The sense amplifiers
75
can then provide the data to the appropriate location indicated by the row, bank, and column addresses.
For reading data from the memory device
40
, the I/O interface
54
, shown in
FIGS. 1 and 2
, under control of the logic control circuit
42
prefetches 64 bits of data from a memory array
46
and transfers the prefetched data to the output circuit
81
responsive to the internal clock signal CKINT. The I/O interface
54
includes a set of sense amplifiers
75
for each complementary digit line pair. For example, an array having 512 digit line pairs would include 512 sense amplifiers
75
that read data from the digit lines and provide complementary output data in response. A set of multiplexers
91
receive the complementary data from the sense amplifiers
75
and, responsive to a control signal from the logic control circuit
42
, output the 64 bits of complementary data. As shown in
FIG. 2
for the example described above of a 512 column array, the multiplexers
91
would be 8-to-1 multiplexers so that each multiplexer
91
would output data from one of 8 digit line pairs.
The output data from each multiplexer
91
in the multiplex

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