Method of electrical connection between head transducer and susp

Details Method of electrical connection between head transducer and susp Method of electrical connection between head transducer and susp

1996-09-27

1998-10-13

Mills, Gregory L.

Electric heating

Metal heating

By arc

2960306, 22818022, 2281115, B23K 2600

Patent

active

058214941

ABSTRACT:
A method of making a solder connection between a slider pad and a suspension pad is provided by forming a solder bump on the solder pad at the slider level, affixing the slider to the suspension so that solder can be reflowed between the slider pad and the suspension pad and then employing a laser beam to reflow at least the solder bump to form a solder connection between the slider pad and the suspension pad. Various embodiments of the method are employed for forming the solder connection. Geometric features are also optionally incorporated in the suspension pad region of the integrated suspension that can be employed to bias the suspension pads against the solder bumps in the pre-reflow state.

REFERENCES:
patent: 3463898 (1969-08-01), Takaoka et al.
patent: 4761699 (1988-08-01), Ainslie et al.
patent: 4789914 (1988-12-01), Ainslie et al.
patent: 4893742 (1990-01-01), Bullock
patent: 4970365 (1990-11-01), Chalco
patent: 4996623 (1991-02-01), Erpelding et al.
patent: 5001583 (1991-03-01), Matsuzaki
patent: 5124277 (1992-06-01), Tsumura
patent: 5172851 (1992-12-01), Matsushita et al.
patent: 5177860 (1993-01-01), Yura et al.
patent: 5187623 (1993-02-01), Ibaraki
patent: 5193738 (1993-03-01), Hayes
patent: 5298715 (1994-03-01), Chalco et al.
patent: 5299729 (1994-04-01), Matsushita et al.
patent: 5327310 (1994-07-01), Bischoff et al.
patent: 5366692 (1994-11-01), Ogashiwa
patent: 5384090 (1995-01-01), Ogashiwa
patent: 5530604 (1996-06-01), Pattanaik
patent: 5680275 (1997-10-01), Frater et al.
patent: 5699212 (1997-12-01), Erpelding et al.

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