Electronic assembly with optimum heat dissipation

Details Electronic assembly with optimum heat dissipation Electronic assembly with optimum heat dissipation

1991-12-26

1993-12-21

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257712, 174 163, 165 802, 16510433, 361704, 361707, H01L 2302, H01L 3902

Patent

active

052723755

ABSTRACT:
An electronic assembly contains a semiconductor chip, a metal heat spreading layer, a dielectric layer and a metal heat sink wherein superior heat dissipation is present.

REFERENCES:
patent: 4069497 (1978-01-01), Steidlitz
patent: 4509096 (1985-04-01), Baldwin et al.
patent: 4510519 (1985-04-01), Dubois et al.
patent: 4626203 (1987-02-01), Ngo et al.
patent: 4631819 (1986-12-01), Lasier et al.
patent: 4685987 (1987-08-01), Fick
patent: 4729061 (1988-03-01), Brown
patent: 4782893 (1988-11-01), Thomas
patent: 4901137 (1990-02-01), Sato et al.
patent: 4963414 (1990-10-01), LeVasseur et al.
patent: 5043796 (1991-08-01), Lester

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