Thermal stress relieving substrate

Details Thermal stress relieving substrate Thermal stress relieving substrate

1997-04-21

1999-02-23

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257731, H01L 2348, H01L 2352, H01L 2940

Patent

active

058747761

ABSTRACT:
A substrate for connecting one element having a first coefficient of thermal expansion to another element having a differing coefficient of thermal expansion that will alleviate interconnection problems due to thermal mismatch.

REFERENCES:
patent: 4152175 (1979-05-01), Burgess et al.
patent: 4427993 (1984-01-01), Fichot et al.
patent: 4791248 (1988-12-01), Oldenetel et al.
patent: 4824381 (1989-04-01), Hertzberg
patent: 4994903 (1991-02-01), Wroe et al.
patent: 5012324 (1991-04-01), Martin et al.
patent: 5272375 (1993-12-01), Belopolsky
patent: 5422788 (1995-06-01), Heinen

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