Substrate polishing apparatus

Details Substrate polishing apparatus Substrate polishing apparatus

1995-06-03

1999-08-17

Rose, Robert A.

Abrading

Precision device or process - or with condition responsive...

With feeding of tool or work holder

451 41, 451173, B24B 722

Patent

active

059385049

ABSTRACT:
A chemical mechanical polishing apparatus includes a rotating plate on which a substrate is received, and a polishing pad which moves across the substrate as it rotates on the plate to polish the substrate. The load of the pad against the substrate, and the rotary speed of the plate, may be varied to control the rate of material removed by the pad.

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Porter & Cable, 1990, Instruction Manual, Porter Cable Model 330 Finishing Sander.

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