Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1992-03-27
1993-12-21
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156651, 156654, 156662, 156345, 252 795, H01L 21306, B44C 122
Patent
active
052717968
ABSTRACT:
A method of detecting a defect on the surface of a semiconductor substrate, including: a first etching step of etching a semiconductor substrate by a first etching amount; a first check step of applying a beam to the surface of the substrate underwent the first etching step, and detecting a first reflected beam; a second etching step of etching the substrate etched by the first etching amount, by an additional etching amount, to make the total etching amount a second etching amount; a second check step of applying the beam to the surface of the substrate underwent the second etching step, and detecting a second reflected beam; and a calculation step of calculating the relation between the first and second reflected beams.
REFERENCES:
patent: 4243473 (1981-01-01), Yamaguchi et al.
Miyashita et al. (1991) Electrochem. Soc. Extended Abstracts 91-1:286-287, Abstract No. 204: Origin of Surface Micro Defect on Annealed Silicon Wafer.
Hiratsuka Hachiro
Kageyama Mokuji
Miyashita Moriya
Kabushiki Kaisha Toshiba
Powell William A.
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