Heat exchange – With retainer for removable article – Electrical component
Reexamination Certificate
2000-03-14
2002-07-23
Bennett, Henry (Department: 3743)
Heat exchange
With retainer for removable article
Electrical component
C165S104330, C165S185000, C165S135000, C361S069000, C361S700000, C257S706000, C257S715000
Reexamination Certificate
active
06422303
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to apparatus for cooling a microelectronic die. In particular, the present invention relates to a heat dissipation device including an active noise canceling mechanism.
2. State of the Art
Higher performance, lower cost, increased miniaturization of integrated circuit components, and greater packaging density of integrated circuits are ongoing goals of the microelectronics industry. As these goals are achieved, microelectronic dice become smaller. Accordingly, the density of power consumption of the integrated circuit components in the microelectronic die has increased, which, in turn, increases the average junction temperature of the microelectronic die. If the temperature of the microelectronic die or particular areas on the microelectronic die becomes too high, the integrated circuits of the microelectronic die may be damaged (which can result in system reliability problems) or destroyed (system failure).
Such damage or destruction is avoided by thermally attaching heat dissipation devices to the microelectronic die.
FIG. 4
illustrates an exemplary heat dissipation device (shown as a finned heat slug
202
) attached to a microelectronic die
204
with a layer of thermally conductive adhesive
212
. The microelectronic die
204
is electrically attached to a carrier substrate
206
through a plurality of electrical interconnects (shown as first solder balls
208
). A fan assembly
214
is usually attached to the finned heat slug
202
which enhances convective heat dissipation by forcing ambient air through the finned heat slug
202
.
Another known method of removing heat from a microelectronic die is the use of a heat pipe
220
, as shown in
FIG. 5. A
heat pipe
220
is a simple device that can quickly transfer heat from one point to another without the use of electrical or mechanical energy input. The heat pipe
220
is generally formed by evacuating air from a sealed pipe
222
which contains a “working fluid”
224
, such as water or alcohol. The sealed pipe
222
is oriented with a first end
226
proximate a heat source
228
. The working fluid
224
, which is in a liquid phase proximate the heat source
228
, increases in temperature and evaporates to form a gaseous phase of the working fluid
224
, which moves (shown by arrows
232
) toward a second end
234
of the sealed pipe
222
. As the gaseous phase moves toward the sealed pipe second end
234
, it condenses to again form the liquid phase of the working fluid
224
, thereby releasing the heat absorbed during the evaporation of the liquid phase of the working fluid
224
. The liquid phase returns, usually by capillary action or gravity, to the sealed pipe first end
226
proximate the heat source
228
, wherein the process is repeated. Thus, the heat pipe
220
is able to rapidly transfer heat away from the heat source
228
. Various configurations of heat pipes have been used to cool microelectronic dice and they have been used in conjunction with finned heat slugs
202
and fan assemblies
214
(FIG.
4
).
Although these heat dissipation methods are adequate to cool most microelectronic dice, they cannot fully address the heat dissipation requirements of high temperature generating microelectronic dice. One method of addressing the heat dissipation requirements is the use of a refrigeration-type cooling method, as known in the art. However, such refrigeration-type methods are prohibitively expensive. Another method of addressing such heat removal is to simply increase the size or speed (rpm) of the fans (see fan assembly
214
of FIG.
4
). However, this increases the noise generated by the fan. Unfortunately, personal computer (“PC”) manufactures have set fan noise limits to about 24 decibels (avg.) at 1 meter from a PC case and about 29 decibels (avg.) at 1 meter from a liquid crystal display desktop PC case. Thus, only increasing the size or speed of the fans is not an adequate solution.
Therefore, it would be advantageous to develop a heat dissipation device and techniques to cost effectively control heat removal from a microelectronic die, while not increasing the noise generated by the heat dissipation device.
REFERENCES:
patent: 4505326 (1985-03-01), Hazen
patent: 5019880 (1991-05-01), Higgins, III
patent: 5102040 (1992-04-01), Harvey
patent: 5249741 (1993-10-01), Bistline et al.
patent: 5636286 (1997-06-01), Makabe et al.
patent: 5765743 (1998-06-01), Sakiura et al.
patent: 5940272 (1999-08-01), Emori et al.
patent: 5946188 (1999-08-01), Rochel et al.
patent: 6041851 (2000-03-01), Diebel et al.
patent: 6043980 (2000-03-01), Katsui
patent: 6094345 (2000-07-01), Diemunsch
patent: 2236200 (1991-03-01), None
patent: 2-61450 (1990-03-01), None
patent: 4-281125 (1992-10-01), None
patent: 07028479 (1995-01-01), None
patent: 07168579 (1995-04-01), None
patent: 11153099 (1999-08-01), None
Endo Shinya
Ishida Kenzo
Nelson Daryl J.
Bennett Henry
Intel Corporation
McKinnon Terrell
Winkle Robert G.
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