Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2000-03-01
2002-05-28
Baxter, Janet (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C522S100000, C528S103500
Reexamination Certificate
active
06395452
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to a photosensitive resin composition for use as a material for printed wiring boards and a photosensitive resin as a component of the above photosensitive resin composition. The photosensitive resin composition of the present invention is suitable for use as a material which has excellent resolving performances and high heat durability and which shows excellent heat durability and electric insulation in a humidified state.
PRIOR ART OF THE INVENTION
In recent years, it is desired to downsize and compact electronic machines and equipment, and it is therefore as well essential to comply with downsizing, a higher fineness and a decrease in weight and thickness with regard to printed wiring boards. A solder resist material to be applied onto a substrate has been generally selected from those materials which are ultraviolet-curable and developable with a diluted alkali and which is excellent in durability against soldering and solvents. However, “build-up” substrates having fine wirings inside recently come to encounter problems in the heat-resistance of a solder resist, such as a popcorn phenomenon which is caused between a solder resist/sealing resin interface. Further, it is also demanded to increase insulation reliability between lines of a closely packed wiring.
For improving electric insulation and heat resistance, there has been developed a resist containing a cyanate ester compound such as a bismaleimide-triazine resin (BT resin) (Japanese Patent Application No. 08-298641).
A cyanate ester compound is caused to remain during alkali development, and the steps of electroless nickel plating and electroless gold plating after the resist is applied is caused to have a problem.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide a photosensitive resin which can give a photosensitive resin composition having high heat durability and excellent heat durability and electric insulation in a humidified state and having alkali-developability and developability free of problems caused during electroless plating, and a photosensitive resin composition containing the above photosensitive resin.
According to the present invention, there is provided a photosensitive resin (B) which is a reaction product produced by reacting an epoxy acrylate (a) with a cyanate ester compound (b) to obtain a reaction product (A) and reacting the reaction product (A) with a polybasic acid anhydride (c).
According to the present invention, further, there is provided a photosensitive resin composition comprising the above photosensitive resin (B) and an epoxy resin (d).
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Hagiwara Isao
Harada Toru
Ishii Kenji
Yokoyama Jun
Baxter Janet
Clarke Yvette M.
Mitsubishi Gas Chemical Company Inc.
Wenderoth Lind & Ponack LLP
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