Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Reexamination Certificate
2000-05-24
2002-09-10
Huff, Mark F. (Department: 1756)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
C430S315000, C430S328000, C430S322000
Reexamination Certificate
active
06447983
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to photolithography, and more particularly, to new photolithography used in forming film patterns, in which a mask is not required (named smart photolithography by the inventors of the prevent invention).
2. Description of the Related Art
Conventional methods for forming a film pattern include printing such as silk screen printing, photolithography and so on.
The printing method is mainly used in a plasma display panel (PDP) or a field emission display (FED), both being flat-panel display devices. However, according to this method, the thicknesses of the formed patterns are not uniform. Also, it is difficult to form fine patterns.
According to a conventional photolithography, a desired thick-film forming material is dispersed in a photoresist and a surfactant, a dispersing agent and a co-photosensitizer are added thereto to form a photoresist composition. The composition is applied as a coating on a substrate and dried. Then, only a predetermined portion of the substrate is exposed using a photomask and developed, thereby completing a desired film pattern. Such photolithography has the advantage that a fine pattern can be formed, compared to the above-described printing method, but has the following disadvantages.
First, the manufacturing process is long and complicated.
Second, it is very difficult to control processing conditions appropriately during exposure and developing processes. In detail, it is very difficult to appropriately control exposure processing conditions such as exposure time, exposure illuminance or exposure temperature, and development process conditions such as pressure of a developing solution. Since it is difficult to control the processing conditions to within a desirable range, the pattern quality fluctuates depending on changes in the exposure and development processing conditions.
Third, in the conventional exposure process, since exposure is performed for an individual substrate using a batch-type exposure stand, the exposure process bottlenecks the overall photolithography process, thereby lowering the manufacturing efficiency.
Fourth, since exposure direction is fixed in one direction, that is, the substrate must be exposed from the front only, the film which is produced always has uneven hardness. Thus, the pressure of the developing solution should be carefully controlled during the development process.
Fifth, in the case of forming fine patterns, defects in mask patterns such as deformation or blocked holes are frequently generated.
SUMMARY OF THE INVENTION
To solve the above problems, it is an objective of the present invention to provide a photolithography by which a film pattern having improved film characteristics can be manufactured easily and efficiently.
Accordingly, to achieve the above objective, there is provided a smart photolithography method comprising the steps of:
(a) forming a film by coating a film forming composition having a bonding resin and a film forming material on a substrate and drying the resultant;
(b) selectively coating a photosensitive composition comprising a photosensitizer only on a predetermined portion of the film, according to a desired film pattern;
(c) exposing the resultant obtained in step (b); and
(d) forming a desired film pattern by developing the exposed resultant structure.
In step (b), a coating method of the photosensitive composition is not specifically restricted. Preferably, the photosensitive composition is sprayed through a nozzle according to the desired film pattern.
In step (c), a photo-reaction is caused in the portion where the photosensitive composition is coated without a photomask.
REFERENCES:
patent: 4767642 (1988-08-01), Shimizu et al.
patent: 5384007 (1995-01-01), Fischer
patent: 7-219236 (1995-08-01), None
IBM Technical Disclosure Bulletin, Planarizing Metal Insulator Structures, Jan. 1983, vol. 25, Iss. No. 8, p. No. 4141.
Do Young-rag
Han Yong
Lee Joon-bae
Chacko-Davis Daborah
Huff Mark F.
Leydig Voit & Mayer Ltd
Samsung SDI & Co., Ltd.
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