Compliant fluidic coolant hat

Details Compliant fluidic coolant hat Compliant fluidic coolant hat

1992-05-08

1995-02-14

Rivell, John

Heat exchange

With retainer for removable article

Electrical component

165185, 165 46, 257714, 361699, 361701, 361702, F28F 700

Patent

active

053886356

ABSTRACT:
A cooling hat for transferring heat from a surface or plurality of heat generating components to a flowing fluid includes a coldsheet, a plurality of manifold layers and springs. The coldsheet is typically a medium-thin metal sheet usually with fine fins or grooves to readily transfer heat to a coolant. Each manifold layer is typically molded rubber with conduits for coolant supply and return. The conduits form a branched hierarchy. The fluid flow is highly parallel and streamlined which achieves ample flow with small hydraulic differential pressure. Springs gently urge the cooling hat against the thermal joints hence against the components. The hat can bend slightly to conform to a curved surface. Typically some compliance is provided by the hat, and other compliance is provided by a thermal joint between each component and the coldsheet. The system is highly self-aligned for counteracting variations.

REFERENCES:
patent: 3361195 (1968-01-01), Meyerhoff et al.
patent: 3405323 (1968-10-01), Surty et al.
patent: 3626252 (1971-12-01), Cath
patent: 4069497 (1978-01-01), Steidlitz
patent: 4072188 (1978-02-01), Wilson et al.
patent: 4092697 (1978-05-01), Spaight
patent: 4109707 (1978-08-01), Wilson et al.
patent: 4138692 (1979-02-01), Meeker et al.
patent: 4151547 (1979-04-01), Rhodes et al.
patent: 4226281 (1980-10-01), Chu
patent: 4233645 (1980-11-01), Balderes et al.
patent: 4258411 (1981-03-01), Sherman
patent: 4264431 (1981-03-01), Babuka et al.
patent: 4323914 (1982-04-01), Berndlmaier et al.
patent: 4341432 (1982-07-01), Cutchaw
patent: 4381032 (1983-04-01), Cutchaw
patent: 4386505 (1983-06-01), Little
patent: 4462462 (1984-07-01), Meagher et al.
patent: 4468717 (1984-08-01), Mathias et al.
patent: 4475152 (1984-10-01), Ikegame et al.
patent: 4494171 (1985-01-01), Bland et al.
patent: 4531146 (1985-07-01), Cutchaw
patent: 4546409 (1985-10-01), Yoshino et al.
patent: 4551787 (1985-11-01), Mittal et al.
patent: 4558395 (1985-12-01), Yamada et al.
patent: 4559580 (1985-12-01), Lutfy
patent: 4561011 (1985-12-01), Kohara et al.
patent: 4561040 (1985-12-01), Eastman et al.
patent: 4567505 (1986-01-01), Pease et al.
patent: 4602314 (1986-07-01), Broadbent
patent: 4607277 (1986-08-01), Hassan et al.
patent: 4612601 (1986-04-01), Watari
patent: 4635709 (1987-01-01), Altoz
patent: 4639829 (1987-01-01), Ostergren
patent: 4730665 (1988-03-01), Cutchaw
patent: 4730666 (1988-03-01), Flint et al.
patent: 4758926 (1988-07-01), Herrell et al.
patent: 4765397 (1988-08-01), Chrysler et al.
patent: 4884630 (1989-12-01), Nelson et al.
patent: 4923003 (1990-05-01), Stenlund
patent: 4953634 (1990-09-01), Nelson et al.
Anacker, "Liquid Cooling of Integrated Circuit Chips", IBM Technical Disclosure Bulletin, vol. 20, No. 9, Feb. 1978, pp. 3742, 3743.
D. B. Tuckerman et al, "High-Performance Heat Sinking for VLSI", IEEE Electron Dev. Lett., vol. EDL-2, No. 5, May 1981, pp. 126-129.
Blodgett et al, "Thermal Conduction Module: A High-Performance Multilayer Ceramic Package", IBM J. Res. Develop., vol. 26, No. 1, Jan., 1982, pp. 30-36.
H. Martin, "Heat and Mass Transfer Between Impinging Gas Jets and Solid Surfaces", Advance Heat Transfer, vol. 13 (1977).
R. C. Chu, IBM TDB "Design for Providing Thermal Interface Material Between Narrow Thermal Interface Gaps", vol. 20, No. 7, Dec. 1977, pp. 2761-2762.
R. C. Chu et al, IBM TDB "Force-Free Solid Thermal Conduction Module", vol. 23, No. 3, Aug. 1980, pp. 1123-1124.
J. A. Andrews, "Parallel Printed Circuit Manifold", Motorola Technical Developments, vol. 7, Oct. 1987, pp. 22-23.
"Flexible Manifold System For Supply And Return Connectins To An Array of Liquid-Cooled Heat-Transfer Elements In A Circuit Module", IBM Technical Disclosure Bulletin, vol. 30, No. 5, Oct. 1987, pp. 317-318.
J. A. McDonald et al, "Custom Tailoring of Chip Temperatures In A Singular Temperature Environment", IBM Technical Disclosure Bulletin, vol. 21, No. 6, Nov. 1978, pp. 2441-2442.

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