Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate
2008-07-15
2008-07-15
Chambliss, Alonzo (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
C438S667000, C174S262000, C257S698000, C257S774000
Reexamination Certificate
active
07399661
ABSTRACT:
A method for making an integrated circuit substrate having embedded back-side access conductors and vias provides a high-density mounting and interconnect structure for integrated circuits that is compatible with etched, plated or printed pre-manufactured substrate components. A circuit board or film having a pre-plated, etched or printed circuit, for example a rigid substrate having a Ball Grid Array (BGA) ball-attach pattern, is laser perforated to produce blind vias and/or conductive patterns that provide contact through to conductors of the prefabricated circuit board or film. Existing circuit board and substrate technology is thereby made compatible with laser-embedding technologies, providing the low-cost advantages of existing etching, plating and printing technologies along with a high conductor density associated with laser-embedded circuit technologies.
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Huemoeller
Hiner David Jon
Huemoeller Ronald Patrick
Rusli Sukianto
Amkor Technology Inc.
Chambliss Alonzo
Gunnison McKay & Hodgson, L.L.P.
Hodgson Serge J.
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